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产品名称:

软硬结合印刷电路板

No of Layer: double sided

No of layer: double sided

Board thickness: 2.4mm

Copper thickness: 6OZ/210um

产品编号:

JSP1-3

上架时间:

2014-11-08

浏览次数:

1000

产品分类:

软硬结合印刷电路板

产品描述

  Jaapson is seeing more and more Customers migrating to Flex & Flex-Rigid due to the benefits of its construction also on commercial use, some examples as follows:

  3D Interconnect;

  1 part component (as apposed to multiple rigid PCB’s and wiring looms);

  Increased reliability;

  Space saver;

  Reduced labour costs at assembling;

  Fully tested as one pcb component;

  1 part inventory.

  Product realisation utilises the same controlled and audited manufacturing processes as used for conventional Multi-Layer technologies.

  Applications:

  Formula 1

  Medical devices

  Aerospace (military flight).

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