产品名称：
盲埋孔电路板
No of Layer: double sided
No of layer: double sided
Board thickness: 2.4mm
Copper thickness: 6OZ/210um
产品编号：
JPS-20151223
上架时间：
2015-12-23
浏览次数：
1000
产品分类：
高密度线路印刷电路板
产品描述
8 Layer HDI PCB
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing
APPLICATION: Medical, Aerospace, Telecommunications, Robotics
